A Study About Optimization in Fine Pitch Copper Wire Bonding Process  
Author Chiao-Tzu Huang


Co-Author(s) Wei-Ling Wang; He-Yau Kang; Kun-I Cheng


Abstract Copper wire bonding process in semiconductor packaging technology shows the trend to be comprehensively introduced to in packaging process. Copper wire presents the advantages of low price and high hardness and could save a lot of costs. Along with the development of smart phones, tablets, and wearable handy devices being multi-functional integrated, high-density and high pin-foot wire bonding in packaging industry is stepping toward fine pitch high-precision process. With Taguchi Method, Orthogonal Array is applied in this study to allocate experimental parameters. For the quality requirement, this study first focuses on the first bond copper ball shear and copper wire tension in packaging wire bonding process to study the optimal key factors and levels for wire bonding process and further enhance the wire bonding process capability. Process capability index is further used for measuring yield rate, expecting to construct an excellent quality management system for promoting process technology and strengthen a company’s competitiveness, with the methods and processes used in this study, for the sustainedyield management of an enterprise.


Keywords Ass’y process, Cu Wire Bonding, Taguchi Method, Process Capability Index
    Article #:  24135
Proceedings ISSAT International Conference on Reliability and Quality in Design 2018
August 2-4, 2018 - Toronto, Ontario, Canada