Six Sigma Based Approach to Enhance the PCB Yield  
Author Li-Fei Chen

 
Co-Author(s) Hung-Chun Lin; Hui-Po Hsu; Chao-Ton Su

 
Abstract This paper presents a case study that a PCB company applies DMAIC-based Six Sigma methodology to improve product yield and to reduce discarding cost. According to the analysis, the inner layer open is one of the reasons that results in PCBs defect units in this case. After improving the manufacturing process, the PCBs defect units were successfully reduced from 82,100 to 69,700 defects per million, generating a cost savings of US$1.41 million.

 
Keywords printed circuit board, DMAIC, Six Sigma
   
    Article #:  1915
 
Proceedings of the 19th ISSAT International Conference on Reliability and Quality in Design
August 5-7, 2013 - Honolulu, Hawaii, U.S.A.