Reliability Modeling and Life Testings of Main PCB Unit for Electro Cardiographic Systems(ECG)  
Author Sung-Min Kim

 
Co-Author(s) Jung-Won Park; Jeong-Hwan Cho

 
Abstract This paper presents an approach to analyze accelerated life testings(ALTs) of main PCB units in electrocardiographic systems and ECG under high temperature conditions. In the field, the component that has the highest failure rate is the main PCB in electrocardiographic systems. The reliability modeling of Arrhenius equation related to temperature and accelerated life testings(ALTs) of main PCB units in electrocardiographic systems and main system(ECG) under high temperature were carried out. For ECG and main PCB unit in electrocardio graphic systems, testing conditions of the same failure-mechanism were adopted in according to accelerated stress and accelerated life testings & acceleration factors were developed. The accelerated life testings were carried out at 50 °C, 60 °C. An acceleration factor(AF) and three parameters of a life test model were calculated and average life of main PCB unit and electrocardiograph(ECG) at normal condition was estimated. The analysis shows that the shape parameter of the life distribution can change with two test conditions respectively.

 
Keywords Reliability, Modeling, Life testing, ALTs, Acceleration factor(AF), Arrhenius equation, Electrocardiograph(ECG), Electrocardiographic system
   
    Article #:  18185
 
Proceedings of the 18th ISSAT International Conference on Reliability and Quality in Design
July 26-28, 2012 - Boston, Massachusetts, U.S.A.