IC Packaging Process Quality Evaluation for Smart Manufacturing Environments  
Author Kuen-Suan Chen

 
Co-Author(s) Chun-Min Yu

 
Abstract The output of Taiwan’s wafer foundry and IC packaging and testing industries ranks first in the world. Its electronic industry boasts a high cluster density, securing its key position in the global market. Increasing the process quality and yield of IC packaging can reduce the scrap rates of IC components and the replacement rates of failed components. Many studies have indicated that wire bonding is a crucial process in the IC packaging industry chain, which follows a professional division of labor model. According to Taguchi loss functions, inadequate process capabilities in gold wire bonding will affect the operating performance of IC components and cause them to malfunction within a short period of time. IC components are widely used in products in network communications, consumer electronics, automobiles, industry, aerospace, and national defense. If any of the IC components in these products malfunction, they will cease to operate normally and require repairs, causing economic losses and increases in carbon emissions. Firms require swift responses, which means that decisions must be made with small sample sizes. We therefore propose a fuzzy evaluation model for the operating performance of IC components based on the process capability of gold wire bonding. We first create an IC component operating performance index. This is achieved by combining all of the process capability indices (PCIs) used to evaluate gold wire bonding and utilizing both the inequality between the PCIs and product yield and the principle in which the number of failures follows a Poisson distribution. By deriving the confidence intervals of the PCIs, we next obtain the confidence interval of this index and use this as the basis of our fuzzy evaluation model. The proposed model aids firms in the electronics industry in the assessment and improvement of process quality.

 
Keywords process capability index; product yield; operating performance of IC component; confidence interval; Poisson distribution
   
    Article #:  RQD2025-86
 

Proceedings of 30th ISSAT International Conference on Reliability & Quality in Design
August 6-8, 2025